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Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃

Nama merek:	Jietai
Nomor Model:	JTM-100504AD
Moq:	1
harga:	￥800000
Waktu Pengiriman:	30-60work days
Ketentuan Pembayaran:	T/T

Informasi Rinci

Deskripsi produk

Informasi Rinci

Place of Origin:

Dongguan, Guangdong

Sertifikasi:

CE, FCC, ROHS, etc.

Model:

JTM-100504AD

Power:

120KW

Type:

Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing

Cleaning Frequency:

40KHZ/80KHZ

Number of Tanks:

Cleaning temperature:

Overall Dimensions:

12M*2M*2.8M

Name:

Semiconductor Cleaning Machine

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Supply Ability:

One unit. It will take 30 to 60 days.

Deskripsi produk

Product Introduction: Semiconductor Silicon Wafer Cleaner

Engineered specifically for semiconductor manufacturing, this precision cleaning system integrates multi-stage ultrasonic processes to meet the stringent surface purity requirements of silicon wafers, ensuring minimal particle contamination and residual removal critical for wafer fabrication.

Core Cleaning Processes:

Ultrasonic Alkaline Cleaning: Utilizes alkaline chemistry combined with ultrasonic energy to effectively remove organic contaminants, photoresist residues, and large particulate matter from wafer surfaces, preparing substrates for subsequent processing.
Ultrasonic Acid Cleaning: Targets inorganic impurities (e.g., metal ions, oxides) through acid-based ultrasonic treatment, leveraging cavitation effects to dislodge submicron contaminants embedded in wafer textures or patterned structures.
DI Water Rinsing: Final stage employs high-purity deionized water for thorough rinsing, eliminating residual cleaning agents and ensuring surface neutrality, a prerequisite for post-cleaning wafer handling and processing.

Technical Specifications:

Ultrasonic Frequency: 40KHz-80KHz (multi-frequency adjustable, optimizing cavitation intensity for different contamination types)
Operating Temperature: 60℃ (precision-controlled thermal environment to enhance chemical reactivity and cleaning efficiency)
Material Compatibility: Constructed with PVDF, quartz, and 316L stainless steel components to resist corrosive chemistries and prevent secondary contamination.

Key Advantages:

Achieves sub-10nm particle removal efficiency, compliant with SEMI standards for advanced wafer processing
Multi-frequency ultrasonic configuration adapts to diverse cleaning requirements (from bare wafer to patterned wafer stages)
Closed-loop temperature control ensures process repeatability, critical for batch-to-batch consistency
Integrates seamlessly into semiconductor front-end and back-end manufacturing lines

Application: Ideal for cleaning silicon wafers in IC manufacturing, MEMS fabrication, and semiconductor packaging processes, where surface integrity directly impacts device performance and yield.

Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, DI water rinsing, 40-80KHz, 60℃ temperature control, silicon wafer processing

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃ 0

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃ 2

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃ 3

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃ 4

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃ 5

Tags:

Pembersih Ultrasonik Otomatis

Peralatan pembersih ultrasonik

Sistem Pembersihan Ultrasonik

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Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃

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Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃

Nama merek:	Jietai
Nomor Model:	JTM-100504AD
Moq:	1
harga:	￥800000
Rincian kemasan:	Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M2M2.8M
Ketentuan Pembayaran:	T/T

Informasi Rinci

Deskripsi produk

Informasi Rinci

Place of Origin:

Dongguan, Guangdong

Nama merek:

Jietai

Sertifikasi:

CE, FCC, ROHS, etc.

Model Number:

JTM-100504AD

Model:

JTM-100504AD

Power:

120KW

Type:

Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing

Cleaning Frequency:

40KHZ/80KHZ

Number of Tanks:

Cleaning temperature:

60℃

Overall Dimensions:

12M*2M*2.8M

Name:

Semiconductor Cleaning Machine

Minimum Order Quantity:

Harga:

￥800000

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Delivery Time:

30-60work days

Payment Terms:

T/T

Supply Ability:

One unit. It will take 30 to 60 days.

Deskripsi produk

Product Introduction: Semiconductor Silicon Wafer Cleaner

Core Cleaning Processes:

Ultrasonic Alkaline Cleaning: Utilizes alkaline chemistry combined with ultrasonic energy to effectively remove organic contaminants, photoresist residues, and large particulate matter from wafer surfaces, preparing substrates for subsequent processing.
Ultrasonic Acid Cleaning: Targets inorganic impurities (e.g., metal ions, oxides) through acid-based ultrasonic treatment, leveraging cavitation effects to dislodge submicron contaminants embedded in wafer textures or patterned structures.
DI Water Rinsing: Final stage employs high-purity deionized water for thorough rinsing, eliminating residual cleaning agents and ensuring surface neutrality, a prerequisite for post-cleaning wafer handling and processing.

Technical Specifications:

Ultrasonic Frequency: 40KHz-80KHz (multi-frequency adjustable, optimizing cavitation intensity for different contamination types)
Operating Temperature: 60℃ (precision-controlled thermal environment to enhance chemical reactivity and cleaning efficiency)
Material Compatibility: Constructed with PVDF, quartz, and 316L stainless steel components to resist corrosive chemistries and prevent secondary contamination.

Key Advantages:

Achieves sub-10nm particle removal efficiency, compliant with SEMI standards for advanced wafer processing
Multi-frequency ultrasonic configuration adapts to diverse cleaning requirements (from bare wafer to patterned wafer stages)
Closed-loop temperature control ensures process repeatability, critical for batch-to-batch consistency
Integrates seamlessly into semiconductor front-end and back-end manufacturing lines

Application: Ideal for cleaning silicon wafers in IC manufacturing, MEMS fabrication, and semiconductor packaging processes, where surface integrity directly impacts device performance and yield.

Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, DI water rinsing, 40-80KHz, 60℃ temperature control, silicon wafer processing

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃ 0

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃ 2

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃ 3

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃ 4

Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 40KHz-80KHz, 60℃ 5

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