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Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃

Name: Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃
Brand: guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
SKU: JTM-100504AD
Price: 800000 USD
Availability: InStock

Brand Name:	Jietai
Model Number:	JTM-100504AD
MOQ:	1
Price:	￥800000
Delivery Time:	30-60work days
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan, Guangdong

Certification:

CE, FCC, ROHS, etc.

Type:

Ultrasonic Alkaline Washing+Ultrasonic Acid Washing+Pure Water Rinsing

Name:

Semiconductor Cleaning Machine

Model:

JTM-100504AD

Overall Dimensions:

12M*2M*2.8M

Cleaning Frequency:

40KHZ/80KHZ

Power:

120KW

Cleaning Temperature:

60℃

Number Of Tanks:

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Supply Ability:

One unit. It will take 30 to 60 days.

Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaner

A precision-engineered solution for semiconductor manufacturing, this ultrasonic cleaning system integrates multi-stage processes to achieve sub-micron level surface purity on silicon wafers—critical for maintaining device performance in advanced node fabrication (down to 5nm).

Sequential Cleaning Stages:

Ultrasonic Alkaline Scrubbing: Employs 40KHz-80KHz ultrasonic cavitation in alkaline bath to decompose organic contaminants, strip photoresist residuals, and dislodge macro-particles (≥1μm) from wafer surfaces and via structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafer diameters, including edge exclusion zones.

Ultrasonic Acid Etching: Utilizes the same frequency range in acidic media to dissolve inorganic impurities—specifically metal ions (Fe, Cu, Zn) and native oxide layers (SiO₂). Cavitation micro-jets penetrate patterned features to remove embedded sub-100nm contaminants, validated by particle counter readings (≤10 particles/wafer for ≥0.1μm).

UPW Rinsing: Final rinse with ultra-pure water (UPW, TOC ≤5ppb) flushes residual chemistries, achieving surface resistivity ≥18.2MΩ·cm—meeting SEMI F20 standards for pre-deposition cleaning.

Process Parameters:

Frequency Band: 40KHz-80KHz (multi-frequency operation, selectable via HMI for contamination-specific tuning)

Temperature Setpoint: 60℃ (PID-controlled, ±1℃ tolerance) to optimize chemical reaction kinetics without inducing wafer warpage.

Material Compatibility: Wetted components in PFA (perfluoroalkoxy) and sapphire to prevent metallic ion leaching, ensuring zero cross-contamination.

Fab Integration Advantages:

Compatible with FOUP/SMIF pod loading for automated cassette handling, reducing human intervention

Cleanroom-class design (ISO 5) with HEPA-filtered exhaust to maintain Class 1 environment compliance

Recipe storage for 50+ cleaning protocols, adaptable to bare wafers, SOI wafers, and epi-wafers

Application: Essential for pre-litho, post-CMP, and post-etch cleaning in logic, memory, and MEMS fabrication lines.

Keywords: Semiconductor wafer ultrasonic cleaner, alkaline-acid sequential cleaning, UPW rinsing, 40-80KHz, 60℃ process, sub-micron decontamination

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 0

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 2

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 3

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 4

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 5

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Ultrasonic Cleaning System

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Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃

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Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃

Brand Name:	Jietai
Model Number:	JTM-100504AD
MOQ:	1
Price:	￥800000
Packaging Details:	Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M2M2.8M
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan, Guangdong

Brand Name:

Jietai

Certification:

CE, FCC, ROHS, etc.

Model Number:

JTM-100504AD

Type:

Ultrasonic Alkaline Washing+Ultrasonic Acid Washing+Pure Water Rinsing

Name:

Semiconductor Cleaning Machine

Model:

JTM-100504AD

Overall Dimensions:

12M*2M*2.8M

Cleaning Frequency:

40KHZ/80KHZ

Power:

120KW

Cleaning Temperature:

60℃

Number Of Tanks:

Minimum Order Quantity:

Price:

￥800000

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Delivery Time:

30-60work days

Payment Terms:

T/T

Supply Ability:

One unit. It will take 30 to 60 days.

Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaner

Sequential Cleaning Stages:

Ultrasonic Alkaline Scrubbing: Employs 40KHz-80KHz ultrasonic cavitation in alkaline bath to decompose organic contaminants, strip photoresist residuals, and dislodge macro-particles (≥1μm) from wafer surfaces and via structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafer diameters, including edge exclusion zones.

Ultrasonic Acid Etching: Utilizes the same frequency range in acidic media to dissolve inorganic impurities—specifically metal ions (Fe, Cu, Zn) and native oxide layers (SiO₂). Cavitation micro-jets penetrate patterned features to remove embedded sub-100nm contaminants, validated by particle counter readings (≤10 particles/wafer for ≥0.1μm).

UPW Rinsing: Final rinse with ultra-pure water (UPW, TOC ≤5ppb) flushes residual chemistries, achieving surface resistivity ≥18.2MΩ·cm—meeting SEMI F20 standards for pre-deposition cleaning.

Process Parameters:

Frequency Band: 40KHz-80KHz (multi-frequency operation, selectable via HMI for contamination-specific tuning)

Temperature Setpoint: 60℃ (PID-controlled, ±1℃ tolerance) to optimize chemical reaction kinetics without inducing wafer warpage.

Material Compatibility: Wetted components in PFA (perfluoroalkoxy) and sapphire to prevent metallic ion leaching, ensuring zero cross-contamination.

Fab Integration Advantages:

Compatible with FOUP/SMIF pod loading for automated cassette handling, reducing human intervention

Cleanroom-class design (ISO 5) with HEPA-filtered exhaust to maintain Class 1 environment compliance

Recipe storage for 50+ cleaning protocols, adaptable to bare wafers, SOI wafers, and epi-wafers

Application: Essential for pre-litho, post-CMP, and post-etch cleaning in logic, memory, and MEMS fabrication lines.

Keywords: Semiconductor wafer ultrasonic cleaner, alkaline-acid sequential cleaning, UPW rinsing, 40-80KHz, 60℃ process, sub-micron decontamination

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 0

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 2

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 3

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 4

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 5

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