logo
Giá tốt. trực tuyến

Chi tiết sản phẩm

Created with Pixso. Nhà Created with Pixso. các sản phẩm Created with Pixso.
Máy làm sạch bán dẫn
Created with Pixso. Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃

Tên thương hiệu: Jietai
Số mẫu: JTM-100504AD
MOQ: 1
giá bán: ¥800000
Thời gian giao hàng: 30-60work days
Điều khoản thanh toán: T/T
Thông tin chi tiết
Place of Origin:
Dongguan, Guangdong
Chứng nhận:
CE, FCC, ROHS, etc.
Type:
Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing
Name:
Semiconductor Cleaning Machine
Model:
JTM-100504AD
Overall Dimensions:
12M*2M*2.8M
Cleaning Frequency:
40KHZ/80KHZ
Power:
120KW
Cleaning temperature:
60℃
Number of Tanks:
10
Packaging Details:
Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M
Supply Ability:
One unit. It will take 30 to 60 days.
Mô tả sản phẩm
Product Introduction: Semiconductor Silicon Wafer Cleaner
A precision-engineered solution for semiconductor manufacturing, this ultrasonic cleaning system integrates multi-stage processes to achieve sub-micron level surface purity on silicon wafers—critical for maintaining device performance in advanced node fabrication (down to 5nm).
Sequential Cleaning Stages:
  • Ultrasonic Alkaline Scrubbing: Employs 40KHz-80KHz ultrasonic cavitation in alkaline bath to decompose organic contaminants, strip photoresist residuals, and dislodge macro-particles (≥1μm) from wafer surfaces and via structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafer diameters, including edge exclusion zones.
  • Ultrasonic Acid Etching: Utilizes the same frequency range in acidic media to dissolve inorganic impurities—specifically metal ions (Fe, Cu, Zn) and native oxide layers (SiO₂). Cavitation micro-jets penetrate patterned features to remove embedded sub-100nm contaminants, validated by particle counter readings (≤10 particles/wafer for ≥0.1μm).
  • UPW Rinsing: Final rinse with ultra-pure water (UPW, TOC ≤5ppb) flushes residual chemistries, achieving surface resistivity ≥18.2MΩ·cm—meeting SEMI F20 standards for pre-deposition cleaning.
Process Parameters:
  • Frequency Band: 40KHz-80KHz (multi-frequency operation, selectable via HMI for contamination-specific tuning)
  • Temperature Setpoint: 60℃ (PID-controlled, ±1℃ tolerance) to optimize chemical reaction kinetics without inducing wafer warpage.
  • Material Compatibility: Wetted components in PFA (perfluoroalkoxy) and sapphire to prevent metallic ion leaching, ensuring zero cross-contamination.
Fab Integration Advantages:
  • Compatible with FOUP/SMIF pod loading for automated cassette handling, reducing human intervention
  • Cleanroom-class design (ISO 5) with HEPA-filtered exhaust to maintain Class 1 environment compliance
  • Recipe storage for 50+ cleaning protocols, adaptable to bare wafers, SOI wafers, and epi-wafers
Application: Essential for pre-litho, post-CMP, and post-etch cleaning in logic, memory, and MEMS fabrication lines.
Keywords: Semiconductor wafer ultrasonic cleaner, alkaline-acid sequential cleaning, UPW rinsing, 40-80KHz, 60℃ process, sub-micron decontamination

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 0Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 1

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 2

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 3

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 4

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 5

Giá tốt. trực tuyến

Chi tiết sản phẩm

Created with Pixso. Nhà Created with Pixso. các sản phẩm Created with Pixso.
Máy làm sạch bán dẫn
Created with Pixso. Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃

Tên thương hiệu: Jietai
Số mẫu: JTM-100504AD
MOQ: 1
giá bán: ¥800000
Chi tiết bao bì: Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M
Điều khoản thanh toán: T/T
Thông tin chi tiết
Place of Origin:
Dongguan, Guangdong
Hàng hiệu:
Jietai
Chứng nhận:
CE, FCC, ROHS, etc.
Model Number:
JTM-100504AD
Type:
Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing
Name:
Semiconductor Cleaning Machine
Model:
JTM-100504AD
Overall Dimensions:
12M*2M*2.8M
Cleaning Frequency:
40KHZ/80KHZ
Power:
120KW
Cleaning temperature:
60℃
Number of Tanks:
10
Minimum Order Quantity:
1
Giá bán:
¥800000
Packaging Details:
Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M
Delivery Time:
30-60work days
Payment Terms:
T/T
Supply Ability:
One unit. It will take 30 to 60 days.
Mô tả sản phẩm
Product Introduction: Semiconductor Silicon Wafer Cleaner
A precision-engineered solution for semiconductor manufacturing, this ultrasonic cleaning system integrates multi-stage processes to achieve sub-micron level surface purity on silicon wafers—critical for maintaining device performance in advanced node fabrication (down to 5nm).
Sequential Cleaning Stages:
  • Ultrasonic Alkaline Scrubbing: Employs 40KHz-80KHz ultrasonic cavitation in alkaline bath to decompose organic contaminants, strip photoresist residuals, and dislodge macro-particles (≥1μm) from wafer surfaces and via structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafer diameters, including edge exclusion zones.
  • Ultrasonic Acid Etching: Utilizes the same frequency range in acidic media to dissolve inorganic impurities—specifically metal ions (Fe, Cu, Zn) and native oxide layers (SiO₂). Cavitation micro-jets penetrate patterned features to remove embedded sub-100nm contaminants, validated by particle counter readings (≤10 particles/wafer for ≥0.1μm).
  • UPW Rinsing: Final rinse with ultra-pure water (UPW, TOC ≤5ppb) flushes residual chemistries, achieving surface resistivity ≥18.2MΩ·cm—meeting SEMI F20 standards for pre-deposition cleaning.
Process Parameters:
  • Frequency Band: 40KHz-80KHz (multi-frequency operation, selectable via HMI for contamination-specific tuning)
  • Temperature Setpoint: 60℃ (PID-controlled, ±1℃ tolerance) to optimize chemical reaction kinetics without inducing wafer warpage.
  • Material Compatibility: Wetted components in PFA (perfluoroalkoxy) and sapphire to prevent metallic ion leaching, ensuring zero cross-contamination.
Fab Integration Advantages:
  • Compatible with FOUP/SMIF pod loading for automated cassette handling, reducing human intervention
  • Cleanroom-class design (ISO 5) with HEPA-filtered exhaust to maintain Class 1 environment compliance
  • Recipe storage for 50+ cleaning protocols, adaptable to bare wafers, SOI wafers, and epi-wafers
Application: Essential for pre-litho, post-CMP, and post-etch cleaning in logic, memory, and MEMS fabrication lines.
Keywords: Semiconductor wafer ultrasonic cleaner, alkaline-acid sequential cleaning, UPW rinsing, 40-80KHz, 60℃ process, sub-micron decontamination

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 0Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 1

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 2

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 3

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 4

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃ 5