Industrial Full-process Precision Cleaning Solution

Core Functions: Three-in-One Efficiency, Full-process Intelligent Closed Loop

1. Ultrasonic Cleaning System: Targeted Removal of Micron-level Contaminants

• Dual-frequency Dynamic Frequency Sweeping Technology:
  • 28kHz Low-frequency Mode: Aims at stubborn stains such as metal surface oxide scale and solder slag (particle size ≥50μm). Through strong cavitation effect, it blasts and strips solid contaminants with a thickness of up to 0.3mm within 3 minutes;
  • 40kHz High-frequency Mode: Penetrates into 0.1mm microholes and gaps to strip liquid contaminants such as flux residues and oils, with an ionic contamination removal rate ≥99.8%;
  • Intelligent Frequency Sweeping Switching: Automatically alternates frequencies every 5 minutes to form a three-dimensional cavitation field, increasing cleaning efficiency by 50% compared to single-frequency mode.
• Ultrasonic Energy Uniformity: Adopts a matrix transducer layout (power density ≥1.2W/cm²) with sound field uniformity error <5%, avoiding local over-cleaning or cleaning blind spots.

2. Steam Bath Washing System: Zero Tolerance for Chemical Residues

• High-temperature Steam Spraying: 120°C saturated steam (pressure 0.3MPa) continuously flushes to dissolve insoluble contaminants such as heavy oil and adhesives. Combined with neutral water-based cleaning agents, it achieves dual removal of polar/non-polar contaminants;
• Condensation Recovery Technology: Steam condensate is filtered through a 0.1μm filter element for cyclic use, reducing water consumption by 70% compared to traditional water washing and increasing cleaning agent utilization to 95%;
• Anti-corrosion Design: The steam chamber uses 316L stainless steel + Teflon coating, resistant to strong corrosion environments with pH=1-14, and suitable for strong acid/alkali cleaning agents.

3. Cooling and Drying System: Ultra-fast Drying, Zero Watermark Residue

• Gradient Cooling Drying:
  ① Hot Air Circulation Stage (80°C, 10min): Rapidly evaporates surface moisture, and optional N₂ purging reduces chamber humidity to ≤10% RH;
  ② Cold Air Cooling Stage (25°C, 5min): Prevents thermal damage to precision components, with surface watermark residue ≤0.01mg/cm² after drying;
• Anti-static Protection: An ionizing air bar (±10V) is 内置 (built-in) in the drying chamber to neutralize surface static electricity in real time, avoiding dust adsorption, suitable for electronic components with fine pitches below 0.1mm.