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Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Name: Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃
Brand: guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
SKU: JTM-100504AD
Price: 800000 USD
Availability: InStock

Brand Name:	Jietai
Model Number:	JTM-100504AD
MOQ:	1
Price:	￥800000
Delivery Time:	30-60work days
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan, Guangdong

Certification:

CE, FCC, ROHS, etc.

Type:

Ultrasonic Alkaline Washing+Ultrasonic Acid Washing+Pure Water Rinsing

Cleaning Frequency:

40KHZ/80KHZ

Number Of Tanks:

Power:

120KW

Overall Dimensions:

12M*2M*2.8M

Model:

JTM-100504AD

Name:

Semiconductor Cleaning Machine

Cleaning Temperature:

60℃

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Supply Ability:

One unit. It will take 30 to 60 days.

Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaner

Specifically engineered for the semiconductor industry, this high-precision cleaning equipment integrates multi-stage ultrasonic processes to achieve ultra-clean surfaces on silicon wafers, a critical prerequisite for ensuring high yield and reliability in microelectronic device manufacturing.

Core Cleaning Processes:

Ultrasonic Alkaline Cleaning: Leverages ultrasonic cavitation in alkaline solutions to efficiently remove organic contaminants, photoresist residues, and large particulate matter from wafer surfaces and microstructures. The controlled energy generated by ultrasonic waves ensures thorough cleaning even in intricate patterns, preparing wafers for subsequent acid treatment.

Ultrasonic Acid Cleaning: Utilizes ultrasonic energy in acidic media to target and eliminate inorganic impurities, including metal ions (such as Fe, Cu, and Ni) and oxide layers. This stage further enhances surface purity by dislodging submicron contaminants that may be embedded in wafer textures, leveraging the frequency-adjustable ultrasonic action for precise cleaning.

Pure Water Rinsing: The final stage employs high-purity water (with resistivity ≥18.2MΩ·cm) to thoroughly rinse away residual cleaning agents, ensuring the wafer surface is free from chemical residues and meets the strict purity standards required for advanced semiconductor processing.

Technical Parameters:

Ultrasonic Frequency Range: 40KHz-80KHz, which is adjustable to adapt to different contamination types and wafer specifications, optimizing cavitation intensity for optimal cleaning results.

Operating Temperature: Maintained at 60℃, a temperature that enhances the reactivity of cleaning solutions while preventing any potential damage to the silicon wafers, ensuring consistent and reliable cleaning performance.

Material Construction: Key components in contact with wafers and cleaning fluids are made of corrosion-resistant materials such as PFA and high-purity quartz, avoiding secondary contamination and ensuring long-term stability of the equipment.

Key Advantages:

Delivers exceptional particle removal efficiency, effectively eliminating particles as small as 0.1μm to meet the stringent requirements of semiconductor manufacturing standards (SEMI).

The combination of ultrasonic alkaline cleaning, ultrasonic acid cleaning, and pure water rinsing forms a complete cleaning cycle, ensuring comprehensive removal of various contaminants.

The adjustable frequency range (40KHz-80KHz) and precise temperature control (60℃) allow for customization according to specific wafer cleaning needs, enhancing process flexibility.

Designed for easy integration into semiconductor production lines, compatible with automated wafer handling systems to streamline manufacturing workflows.

Application: Ideal for cleaning silicon wafers in processes such as pre-lithography, post-etching, and pre-deposition in 4-inch to 12-inch wafer fabrication, suitable for both research and development and mass production environments.

Keywords: Semiconductor silicon wafer cleaner, ultrasonic alkaline cleaning, ultrasonic acid cleaning, pure water rinsing, 40KHz-80KHz, 60℃, wafer surface treatment​

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 0

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 2

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 3

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 4

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 5

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Ultrasonic Cleaning System

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Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

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Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Brand Name:	Jietai
Model Number:	JTM-100504AD
MOQ:	1
Price:	￥800000
Packaging Details:	Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M2M2.8M
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan, Guangdong

Brand Name:

Jietai

Certification:

CE, FCC, ROHS, etc.

Model Number:

JTM-100504AD

Type:

Ultrasonic Alkaline Washing+Ultrasonic Acid Washing+Pure Water Rinsing

Cleaning Frequency:

40KHZ/80KHZ

Number Of Tanks:

Power:

120KW

Overall Dimensions:

12M*2M*2.8M

Model:

JTM-100504AD

Name:

Semiconductor Cleaning Machine

Cleaning Temperature:

60℃

Minimum Order Quantity:

Price:

￥800000

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Delivery Time:

30-60work days

Payment Terms:

T/T

Supply Ability:

One unit. It will take 30 to 60 days.

Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaner

Core Cleaning Processes:

Ultrasonic Alkaline Cleaning: Leverages ultrasonic cavitation in alkaline solutions to efficiently remove organic contaminants, photoresist residues, and large particulate matter from wafer surfaces and microstructures. The controlled energy generated by ultrasonic waves ensures thorough cleaning even in intricate patterns, preparing wafers for subsequent acid treatment.

Ultrasonic Acid Cleaning: Utilizes ultrasonic energy in acidic media to target and eliminate inorganic impurities, including metal ions (such as Fe, Cu, and Ni) and oxide layers. This stage further enhances surface purity by dislodging submicron contaminants that may be embedded in wafer textures, leveraging the frequency-adjustable ultrasonic action for precise cleaning.

Pure Water Rinsing: The final stage employs high-purity water (with resistivity ≥18.2MΩ·cm) to thoroughly rinse away residual cleaning agents, ensuring the wafer surface is free from chemical residues and meets the strict purity standards required for advanced semiconductor processing.

Technical Parameters:

Ultrasonic Frequency Range: 40KHz-80KHz, which is adjustable to adapt to different contamination types and wafer specifications, optimizing cavitation intensity for optimal cleaning results.

Operating Temperature: Maintained at 60℃, a temperature that enhances the reactivity of cleaning solutions while preventing any potential damage to the silicon wafers, ensuring consistent and reliable cleaning performance.

Material Construction: Key components in contact with wafers and cleaning fluids are made of corrosion-resistant materials such as PFA and high-purity quartz, avoiding secondary contamination and ensuring long-term stability of the equipment.

Key Advantages:

Delivers exceptional particle removal efficiency, effectively eliminating particles as small as 0.1μm to meet the stringent requirements of semiconductor manufacturing standards (SEMI).

The combination of ultrasonic alkaline cleaning, ultrasonic acid cleaning, and pure water rinsing forms a complete cleaning cycle, ensuring comprehensive removal of various contaminants.

The adjustable frequency range (40KHz-80KHz) and precise temperature control (60℃) allow for customization according to specific wafer cleaning needs, enhancing process flexibility.

Designed for easy integration into semiconductor production lines, compatible with automated wafer handling systems to streamline manufacturing workflows.

Keywords: Semiconductor silicon wafer cleaner, ultrasonic alkaline cleaning, ultrasonic acid cleaning, pure water rinsing, 40KHz-80KHz, 60℃, wafer surface treatment​

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 0

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 2

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 3

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 4

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 5

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