Detalhes dos produtos

Para casa produtos

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Nome da marca:	Jietai
Número do modelo:	JTM-100504AD
MOQ:	1
preço:	￥800000
Tempo de entrega:	30-60work days
Condições de pagamento:	T/T

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Place of Origin:

Dongguan, Guangdong

Certificação:

CE, FCC, ROHS, etc.

Type:

Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing

Cleaning Frequency:

40KHZ/80KHZ

Number of Tanks:

Power:

120KW

Overall Dimensions:

12M*2M*2.8M

Model:

JTM-100504AD

Name:

Semiconductor Cleaning Machine

Cleaning temperature:

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Supply Ability:

One unit. It will take 30 to 60 days.

Descrição do produto

Product Introduction: Semiconductor Silicon Wafer Cleaner

Specifically engineered for the semiconductor industry, this high-precision cleaning equipment integrates multi-stage ultrasonic processes to achieve ultra-clean surfaces on silicon wafers, a critical prerequisite for ensuring high yield and reliability in microelectronic device manufacturing.

Core Cleaning Processes:

Ultrasonic Alkaline Cleaning: Leverages ultrasonic cavitation in alkaline solutions to efficiently remove organic contaminants, photoresist residues, and large particulate matter from wafer surfaces and microstructures. The controlled energy generated by ultrasonic waves ensures thorough cleaning even in intricate patterns, preparing wafers for subsequent acid treatment.

Ultrasonic Acid Cleaning: Utilizes ultrasonic energy in acidic media to target and eliminate inorganic impurities, including metal ions (such as Fe, Cu, and Ni) and oxide layers. This stage further enhances surface purity by dislodging submicron contaminants that may be embedded in wafer textures, leveraging the frequency-adjustable ultrasonic action for precise cleaning.

Pure Water Rinsing: The final stage employs high-purity water (with resistivity ≥18.2MΩ·cm) to thoroughly rinse away residual cleaning agents, ensuring the wafer surface is free from chemical residues and meets the strict purity standards required for advanced semiconductor processing.

Technical Parameters:

Ultrasonic Frequency Range: 40KHz-80KHz, which is adjustable to adapt to different contamination types and wafer specifications, optimizing cavitation intensity for optimal cleaning results.

Operating Temperature: Maintained at 60℃, a temperature that enhances the reactivity of cleaning solutions while preventing any potential damage to the silicon wafers, ensuring consistent and reliable cleaning performance.

Material Construction: Key components in contact with wafers and cleaning fluids are made of corrosion-resistant materials such as PFA and high-purity quartz, avoiding secondary contamination and ensuring long-term stability of the equipment.

Key Advantages:

Delivers exceptional particle removal efficiency, effectively eliminating particles as small as 0.1μm to meet the stringent requirements of semiconductor manufacturing standards (SEMI).

The combination of ultrasonic alkaline cleaning, ultrasonic acid cleaning, and pure water rinsing forms a complete cleaning cycle, ensuring comprehensive removal of various contaminants.

The adjustable frequency range (40KHz-80KHz) and precise temperature control (60℃) allow for customization according to specific wafer cleaning needs, enhancing process flexibility.

Designed for easy integration into semiconductor production lines, compatible with automated wafer handling systems to streamline manufacturing workflows.

Application: Ideal for cleaning silicon wafers in processes such as pre-lithography, post-etching, and pre-deposition in 4-inch to 12-inch wafer fabrication, suitable for both research and development and mass production environments.

Keywords: Semiconductor silicon wafer cleaner, ultrasonic alkaline cleaning, ultrasonic acid cleaning, pure water rinsing, 40KHz-80KHz, 60℃, wafer surface treatment​

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 0

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 2

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 3

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 4

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 5

Tags:

Limpador ultrassônico automatizado

Equipamento de Limpeza Ultrassônica

Sistema da limpeza ultrassônica

PRODUTOS CONEXOS

Vídeo

Máquina de Limpeza de Semicondutores com 11 Tanques para Limpeza de Pastilhas de Silício 40KHZ

Obtenha o melhor preço

Vídeo

Sistema de limpeza por ultra-som automatizado de 100KW 11 Tanques Máquinas de limpeza por ultra-som

Obtenha o melhor preço

Vídeo

Máquina de limpeza de semicondutores de alta eficiência 250KW

Obtenha o melhor preço

Vídeo

Máquina de limpeza automática de ultra-som de vários estágios Sistema de passivação personalizado

Obtenha o melhor preço

Vídeo

Máquina de Limpeza Manual de Semicondutores Linha de Limpeza Eletrolítica 251KW Personalizada para Corpo de Válvula

Obtenha o melhor preço

Vídeo

Sistema de Limpeza Ultrasônica de Wafers Semicondutores 100KW Limpeador Automático Ultrasônico

Obtenha o melhor preço

Máquina de limpeza de semicondutores de 180KW Sistemas de passivação de corpos de válvulas 40KHZ - 80KHZ

Obtenha o melhor preço

Vídeo

Máquina de limpeza ultrassônica totalmente automática Wafers de silício Equipamento de limpeza ultrassônica 100KW

Obtenha o melhor preço

Detalhes dos produtos

Para casa produtos

Máquina de limpeza de semicondutores

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Todas as categorias

Equipamento de limpeza por ultra-som

Eletrônicos ultra-sônico limpador

Limpeza ultra-sônica de instrumentos

Máquina de limpeza de semicondutores

Limpeza ultrassônica comercial

Limpeza a ultrassom do sector aeroespacial

Líquido de limpeza ultrassônico médico

Limpeza Ultrassônica Personalizada

Máquina da limpeza de pulverizador

Máquina de limpeza de mofo por ultra-som

Limpador ultrassônico automotivo

Equipamento de Tratamento de Efluentes Industriais

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Nome da marca:	Jietai
Número do modelo:	JTM-100504AD
MOQ:	1
preço:	￥800000
Detalhes da embalagem:	Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M2M2.8M
Condições de pagamento:	T/T

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Place of Origin:

Dongguan, Guangdong

Marca:

Jietai

Certificação:

CE, FCC, ROHS, etc.

Model Number:

JTM-100504AD

Type:

Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing

Cleaning Frequency:

40KHZ/80KHZ

Number of Tanks:

Power:

120KW

Overall Dimensions:

12M*2M*2.8M

Model:

JTM-100504AD

Name:

Semiconductor Cleaning Machine

Cleaning temperature:

60℃

Minimum Order Quantity:

Preço:

￥800000

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Delivery Time:

30-60work days

Payment Terms:

T/T

Supply Ability:

One unit. It will take 30 to 60 days.

Descrição do produto

Product Introduction: Semiconductor Silicon Wafer Cleaner

Core Cleaning Processes:

Ultrasonic Alkaline Cleaning: Leverages ultrasonic cavitation in alkaline solutions to efficiently remove organic contaminants, photoresist residues, and large particulate matter from wafer surfaces and microstructures. The controlled energy generated by ultrasonic waves ensures thorough cleaning even in intricate patterns, preparing wafers for subsequent acid treatment.

Ultrasonic Acid Cleaning: Utilizes ultrasonic energy in acidic media to target and eliminate inorganic impurities, including metal ions (such as Fe, Cu, and Ni) and oxide layers. This stage further enhances surface purity by dislodging submicron contaminants that may be embedded in wafer textures, leveraging the frequency-adjustable ultrasonic action for precise cleaning.

Pure Water Rinsing: The final stage employs high-purity water (with resistivity ≥18.2MΩ·cm) to thoroughly rinse away residual cleaning agents, ensuring the wafer surface is free from chemical residues and meets the strict purity standards required for advanced semiconductor processing.

Technical Parameters:

Ultrasonic Frequency Range: 40KHz-80KHz, which is adjustable to adapt to different contamination types and wafer specifications, optimizing cavitation intensity for optimal cleaning results.

Operating Temperature: Maintained at 60℃, a temperature that enhances the reactivity of cleaning solutions while preventing any potential damage to the silicon wafers, ensuring consistent and reliable cleaning performance.

Material Construction: Key components in contact with wafers and cleaning fluids are made of corrosion-resistant materials such as PFA and high-purity quartz, avoiding secondary contamination and ensuring long-term stability of the equipment.

Key Advantages:

Delivers exceptional particle removal efficiency, effectively eliminating particles as small as 0.1μm to meet the stringent requirements of semiconductor manufacturing standards (SEMI).

The combination of ultrasonic alkaline cleaning, ultrasonic acid cleaning, and pure water rinsing forms a complete cleaning cycle, ensuring comprehensive removal of various contaminants.

The adjustable frequency range (40KHz-80KHz) and precise temperature control (60℃) allow for customization according to specific wafer cleaning needs, enhancing process flexibility.

Designed for easy integration into semiconductor production lines, compatible with automated wafer handling systems to streamline manufacturing workflows.

Keywords: Semiconductor silicon wafer cleaner, ultrasonic alkaline cleaning, ultrasonic acid cleaning, pure water rinsing, 40KHz-80KHz, 60℃, wafer surface treatment​

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 0

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 2

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 3

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 4

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 5

Tags: