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40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Name: 40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃
Brand: guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
SKU: JTM-100504AD
Price: 800000 USD
Availability: InStock

Brand Name:	Jietai
Model Number:	JTM-100504AD
MOQ:	1
Price:	￥800000
Delivery Time:	30-60work days
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan, Guangdong

Certification:

CE, FCC, ROHS, etc.

Name:

Semiconductor Cleaning Machine

Number Of Tanks:

Overall Dimensions:

12M*2M*2.8M

Power:

120KW

Cleaning Temperature:

60℃

Type:

Ultrasonic Alkaline Washing+Ultrasonic Acid Washing+Pure Water Rinsing

Cleaning Frequency:

40KHZ/80KHZ

Model:

JTM-100504AD

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Supply Ability:

One unit. It will take 30 to 60 days.

Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaner

Designed for high-precision cleaning in semiconductor manufacturing, this specialized system combines multi-stage ultrasonic processes to meet the rigorous surface purity demands of silicon wafers, directly impacting device reliability and production yield in microelectronics fabrication.

Core Cleaning Procedures:

Ultrasonic Alkaline Cleaning: Employs ultrasonic cavitation in alkaline media to efficiently strip organic contaminants, photoresist residuals, and particulate debris from wafer surfaces and intricate structures (e.g., trenches, vias), creating a pristine substrate for subsequent processing steps.

Ultrasonic Acid Cleaning: Utilizes acid-based ultrasonic agitation to target and remove inorganic impurities, including metal ion contaminants (Fe, Cu, Ni) and native oxide layers, leveraging frequency-induced micro-jets to dislodge submicron particles from patterned or polished surfaces.

Pure Water Rinsing: Final stage utilizes ultra-pure water (UPW) with resistivity ≥18.2MΩ·cm for thorough rinsing, eliminating residual cleaning agents and ensuring surface inertness—critical for post-cleaning wafer handling and thin-film deposition.

Technical Specifications:

Ultrasonic Frequency: 40KHz-80KHz (variable frequency output, allowing optimization of cavitation intensity for different contamination profiles and wafer sizes)

Operating Temperature: 60℃ (precision-controlled thermal environment to enhance chemical reactivity while maintaining wafer structural integrity)

Material Construction: Tanks and contact components made from PFA and high-purity quartz to resist chemical corrosion and prevent particle shedding, ensuring zero secondary contamination.

Key Performance Advantages:

Delivers particle removal efficiency (PRE) of ≥99.9% for particles ≥0.1μm, compliant with SEMI standards for advanced node processing

Multi-frequency ultrasonic configuration adapts to bare wafers, epitaxial wafers, and patterned wafers (down to 7nm technology nodes)

60℃ temperature regulation stabilizes chemical reaction kinetics, ensuring consistent cleaning results across batch operations

Compatible with automated wafer handling systems (SMIF pods, FOUPs) for seamless integration into fab workflows

Application Scope: Essential for pre-lithography, post-CMP (Chemical Mechanical Polishing), and pre-metallization cleaning in 6-inch to 12-inch silicon wafer production lines.

Keywords: Semiconductor wafer cleaning system, ultrasonic alkaline/acid treatment, pure water rinsing, 40-80KHz frequency, 60℃ process, silicon wafer decontamination

This system provides a reliable solution for semiconductor manufacturers seeking to minimize defect rates and enhance process stability in high-volume wafer production.

40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 0

40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 2

40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 3

40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 4

40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 5

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Ultrasonic Cleaning System

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40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

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40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Brand Name:	Jietai
Model Number:	JTM-100504AD
MOQ:	1
Price:	￥800000
Packaging Details:	Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M2M2.8M
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan, Guangdong

Brand Name:

Jietai

Certification:

CE, FCC, ROHS, etc.

Model Number:

JTM-100504AD

Name:

Semiconductor Cleaning Machine

Number Of Tanks:

Overall Dimensions:

12M*2M*2.8M

Power:

120KW

Cleaning Temperature:

60℃

Type:

Ultrasonic Alkaline Washing+Ultrasonic Acid Washing+Pure Water Rinsing

Cleaning Frequency:

40KHZ/80KHZ

Model:

JTM-100504AD

Minimum Order Quantity:

Price:

￥800000

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Delivery Time:

30-60work days

Payment Terms:

T/T

Supply Ability:

One unit. It will take 30 to 60 days.

Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaner

Core Cleaning Procedures:

Ultrasonic Alkaline Cleaning: Employs ultrasonic cavitation in alkaline media to efficiently strip organic contaminants, photoresist residuals, and particulate debris from wafer surfaces and intricate structures (e.g., trenches, vias), creating a pristine substrate for subsequent processing steps.

Ultrasonic Acid Cleaning: Utilizes acid-based ultrasonic agitation to target and remove inorganic impurities, including metal ion contaminants (Fe, Cu, Ni) and native oxide layers, leveraging frequency-induced micro-jets to dislodge submicron particles from patterned or polished surfaces.

Pure Water Rinsing: Final stage utilizes ultra-pure water (UPW) with resistivity ≥18.2MΩ·cm for thorough rinsing, eliminating residual cleaning agents and ensuring surface inertness—critical for post-cleaning wafer handling and thin-film deposition.

Technical Specifications:

Ultrasonic Frequency: 40KHz-80KHz (variable frequency output, allowing optimization of cavitation intensity for different contamination profiles and wafer sizes)

Operating Temperature: 60℃ (precision-controlled thermal environment to enhance chemical reactivity while maintaining wafer structural integrity)

Material Construction: Tanks and contact components made from PFA and high-purity quartz to resist chemical corrosion and prevent particle shedding, ensuring zero secondary contamination.

Key Performance Advantages:

Delivers particle removal efficiency (PRE) of ≥99.9% for particles ≥0.1μm, compliant with SEMI standards for advanced node processing

Multi-frequency ultrasonic configuration adapts to bare wafers, epitaxial wafers, and patterned wafers (down to 7nm technology nodes)

60℃ temperature regulation stabilizes chemical reaction kinetics, ensuring consistent cleaning results across batch operations

Compatible with automated wafer handling systems (SMIF pods, FOUPs) for seamless integration into fab workflows