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Tunable 40-80kHz Silicon Wafer Ultrasonic Cleaner Constant 60°C Temperature Acid Alkaline Cleaning Pure Water Rinsing

Name: Tunable 40-80kHz Silicon Wafer Ultrasonic Cleaner Constant 60°C Temperature Acid Alkaline Cleaning Pure Water Rinsing
Brand: guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
SKU: JTM-100504AD
Price: 800000 USD
Availability: InStock

Brand Name:	Jietai
Model Number:	JTM-100504AD
MOQ:	1
Price:	￥800000
Delivery Time:	30-60work days
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan, Guangdong

Certification:

CE, FCC, ROHS, etc.

Cleaning Frequency:

40KHZ/80KHZ

Type:

Ultrasonic Alkaline Washing+Ultrasonic Acid Washing+Pure Water Rinsing

Name:

Semiconductor Cleaning Machine

Cleaning Temperature:

60℃

Overall Dimensions:

12M*2M*2.8M

Model:

JTM-100504AD

Number Of Tanks:

Power:

120KW

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Supply Ability:

One unit. It will take 30 to 60 days.

Highlight:

Semiconductor silicon wafer ultrasonic cleaner

Alkaline acid cleaning wafer machine

60℃ pure water rinsing cleaner

Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaning System

Tailored for high-precision semiconductor manufacturing, this integrated cleaning system combines multi-stage ultrasonic processes to deliver sub-ppb level surface purity, a critical prerequisite for silicon wafer fabrication in advanced node (≤7nm) microelectronics production.

Stage-by-Stage Cleaning Mechanism:

Ultrasonic Alkaline Cleaning: Operates at 40KHz-80KHz to generate controlled cavitation in alkaline media, efficiently stripping organic contaminants (e.g., photoresist, hydrocarbons) and particulate matter (≥1μm) from wafer surfaces and patterned structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafers, including edge bevels and backside surfaces.

Ultrasonic Acid Cleaning: Utilizes the same frequency range in acidic solutions to target inorganic impurities—specifically metal ion contaminants (Fe, Cu, Zn) and native oxide layers (SiO₂). This stage employs cavitation-induced micro-jets to dislodge sub-100nm particles embedded in trenches or vias, validated by laser particle counters (≤5 particles/wafer for ≥0.1μm).

Pure Water Rinse Cycle: Final rinse with UPW (ultra-pure water, TOC ≤3ppb) eliminates residual chemistries, achieving surface resistivity ≥18.2MΩ·cm to meet SEMI F020 standards for pre-deposition processing.

Technical Specifications:

Ultrasonic Frequency Band: 40KHz-80KHz (multi-frequency selectable via PLC, optimizing cavitation intensity for contamination type)

Process Temperature: 60℃ (PID-controlled, ±0.5℃ tolerance) to accelerate chemical reactivity without inducing wafer stress

Material Compatibility: Wetted components in PFA and high-purity alumina to resist HF/H₂SO₄ corrosion, preventing particle shedding

Core Performance Metrics:

Particle Removal Efficiency (PRE) ≥99.9% for ≥0.1μm contaminants

Chemical residue elimination ≤0.1ng/cm² (ICP-MS verified)

Compatible with automated cassette handling (FOUP/SMIF) for 24/7 fab integration

Application: Essential for pre-litho, post-CMP, and pre-implant cleaning in logic, memory, and sensor wafer production lines.

Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, UPW rinsing, 40-80KHz, 60℃ process, silicon wafer decontamination

This system ensures consistent cleaning performance to maximize yield in high-volume semiconductor manufacturing environments.

Tunable 40-80kHz Silicon Wafer Ultrasonic Cleaner Constant 60°C Temperature Acid Alkaline Cleaning Pure Water Rinsing

Tags:

Automated Ultrasonic Cleaner

Ultrasonic Cleaner Equipment

Ultrasonic Cleaning System

11 Tanks Semiconductor Cleaning Machine Silicon Wafer Cleaning Machine 40KHZ

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100KW Automated Ultrasonic Cleaning System 11 Tanks Ultrasonic Cleaning Machines

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Tunable 40-80kHz Silicon Wafer Ultrasonic Cleaner Constant 60°C Temperature Acid Alkaline Cleaning Pure Water Rinsing

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Tunable 40-80kHz Silicon Wafer Ultrasonic Cleaner Constant 60°C Temperature Acid Alkaline Cleaning Pure Water Rinsing

Brand Name:	Jietai
Model Number:	JTM-100504AD
MOQ:	1
Price:	￥800000
Packaging Details:	Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M2M2.8M
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan, Guangdong

Brand Name:

Jietai

Certification:

CE, FCC, ROHS, etc.

Model Number:

JTM-100504AD

Cleaning Frequency:

40KHZ/80KHZ

Type:

Ultrasonic Alkaline Washing+Ultrasonic Acid Washing+Pure Water Rinsing

Name:

Semiconductor Cleaning Machine

Cleaning Temperature:

60℃

Overall Dimensions:

12M*2M*2.8M

Model:

JTM-100504AD

Number Of Tanks:

Power:

120KW

Minimum Order Quantity:

Price:

￥800000

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Delivery Time:

30-60work days

Payment Terms:

T/T

Supply Ability:

One unit. It will take 30 to 60 days.

Highlight:

Semiconductor silicon wafer ultrasonic cleaner

Alkaline acid cleaning wafer machine

60℃ pure water rinsing cleaner

Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaning System

Stage-by-Stage Cleaning Mechanism:

Ultrasonic Alkaline Cleaning: Operates at 40KHz-80KHz to generate controlled cavitation in alkaline media, efficiently stripping organic contaminants (e.g., photoresist, hydrocarbons) and particulate matter (≥1μm) from wafer surfaces and patterned structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafers, including edge bevels and backside surfaces.

Ultrasonic Acid Cleaning: Utilizes the same frequency range in acidic solutions to target inorganic impurities—specifically metal ion contaminants (Fe, Cu, Zn) and native oxide layers (SiO₂). This stage employs cavitation-induced micro-jets to dislodge sub-100nm particles embedded in trenches or vias, validated by laser particle counters (≤5 particles/wafer for ≥0.1μm).

Pure Water Rinse Cycle: Final rinse with UPW (ultra-pure water, TOC ≤3ppb) eliminates residual chemistries, achieving surface resistivity ≥18.2MΩ·cm to meet SEMI F020 standards for pre-deposition processing.

Technical Specifications:

Ultrasonic Frequency Band: 40KHz-80KHz (multi-frequency selectable via PLC, optimizing cavitation intensity for contamination type)

Process Temperature: 60℃ (PID-controlled, ±0.5℃ tolerance) to accelerate chemical reactivity without inducing wafer stress

Material Compatibility: Wetted components in PFA and high-purity alumina to resist HF/H₂SO₄ corrosion, preventing particle shedding

Core Performance Metrics:

Particle Removal Efficiency (PRE) ≥99.9% for ≥0.1μm contaminants

Chemical residue elimination ≤0.1ng/cm² (ICP-MS verified)

Compatible with automated cassette handling (FOUP/SMIF) for 24/7 fab integration

Application: Essential for pre-litho, post-CMP, and pre-implant cleaning in logic, memory, and sensor wafer production lines.

Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, UPW rinsing, 40-80KHz, 60℃ process, silicon wafer decontamination

This system ensures consistent cleaning performance to maximize yield in high-volume semiconductor manufacturing environments.

Tunable 40-80kHz Silicon Wafer Ultrasonic Cleaner Constant 60°C Temperature Acid Alkaline Cleaning Pure Water Rinsing

Tags: