products details

Home Products

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Name: Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃
Brand: guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
SKU: JTM-100504AD
Price: 800000 USD
Availability: InStock

Brand Name:	Jietai
Model Number:	JTM-100504AD
MOQ:	1
Price:	￥800000
Delivery Time:	30-60work days
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan, Guangdong

Certification:

CE, FCC, ROHS, etc.

Cleaning Frequency:

40KHZ/80KHZ

Type:

Ultrasonic Alkaline Washing+Ultrasonic Acid Washing+Pure Water Rinsing

Name:

Semiconductor Cleaning Machine

Cleaning Temperature:

60℃

Overall Dimensions:

12M*2M*2.8M

Model:

JTM-100504AD

Number Of Tanks:

Power:

120KW

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Supply Ability:

One unit. It will take 30 to 60 days.

Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaning System

Tailored for high-precision semiconductor manufacturing, this integrated cleaning system combines multi-stage ultrasonic processes to deliver sub-ppb level surface purity, a critical prerequisite for silicon wafer fabrication in advanced node (≤7nm) microelectronics production.

Stage-by-Stage Cleaning Mechanism:

Ultrasonic Alkaline Cleaning: Operates at 40KHz-80KHz to generate controlled cavitation in alkaline media, efficiently stripping organic contaminants (e.g., photoresist, hydrocarbons) and particulate matter (≥1μm) from wafer surfaces and patterned structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafers, including edge bevels and backside surfaces.

Ultrasonic Acid Cleaning: Utilizes the same frequency range in acidic solutions to target inorganic impurities—specifically metal ion contaminants (Fe, Cu, Zn) and native oxide layers (SiO₂). This stage employs cavitation-induced micro-jets to dislodge sub-100nm particles embedded in trenches or vias, validated by laser particle counters (≤5 particles/wafer for ≥0.1μm).

Pure Water Rinse Cycle: Final rinse with UPW (ultra-pure water, TOC ≤3ppb) eliminates residual chemistries, achieving surface resistivity ≥18.2MΩ·cm to meet SEMI F020 standards for pre-deposition processing.

Technical Specifications:

Ultrasonic Frequency Band: 40KHz-80KHz (multi-frequency selectable via PLC, optimizing cavitation intensity for contamination type)

Process Temperature: 60℃ (PID-controlled, ±0.5℃ tolerance) to accelerate chemical reactivity without inducing wafer stress

Material Compatibility: Wetted components in PFA and high-purity alumina to resist HF/H₂SO₄ corrosion, preventing particle shedding

Core Performance Metrics:

Particle Removal Efficiency (PRE) ≥99.9% for ≥0.1μm contaminants

Chemical residue elimination ≤0.1ng/cm² (ICP-MS verified)

Compatible with automated cassette handling (FOUP/SMIF) for 24/7 fab integration

Application: Essential for pre-litho, post-CMP, and pre-implant cleaning in logic, memory, and sensor wafer production lines.

Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, UPW rinsing, 40-80KHz, 60℃ process, silicon wafer decontamination

This system ensures consistent cleaning performance to maximize yield in high-volume semiconductor manufacturing environments.

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 0

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 2

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 3

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 4

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃ 5

Tags:

Automated Ultrasonic Cleaner

Ultrasonic Cleaner Equipment

Ultrasonic Cleaning System

11 Tanks Semiconductor Cleaning Machine Silicon Wafer Cleaning Machine 40KHZ

Get Best Price

Video

100KW Automated Ultrasonic Cleaning System 11 Tanks Ultrasonic Cleaning Machines

Get Best Price

Video

High Efficiency Semiconductor Cleaning Machine 250KW Customized Ultrasonic Cleaner

Get Best Price

Video

Multi Stage Automated Ultrasonic Cleaning Machine Customized Passivation System

Get Best Price

Video

Manual Semiconductor Cleaning Machine 251KW Electrolytic Cleaning Line Customized For Valve Body

Get Best Price

Video

Semiconductor Wafers Ultrasonic Cleaning System 100KW Automated Ultrasonic Cleaner

Get Best Price

180KW Semiconductor Cleaning Machine Valve Bodies Passivation Systems 40KHZ - 80KHZ

Get Best Price

Video

Fully Automatic Ultrasonic Cleaning Machine Silicon Wafers Ultrasonic Cleaner Equipment 100KW

Get Best Price

Products Details

Home Products

Semiconductor Cleaning Machine

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

All Category

Ultrasonic Cleaning Equipment

Electronics Ultrasonic Cleaner

Instrument Ultrasonic Cleaner

Semiconductor Cleaning Machine

Commercial Ultrasonic Cleaner

Aerospace Ultrasonic Cleaner

Medical Ultrasonic Cleaner

Custom Ultrasonic Cleaner

Spray Cleaning Machine

Ultrasonic Mold Cleaning Machine

Automotive Ultrasonic Cleaner

Industrial Wastewater Treatment Equipment

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Brand Name:	Jietai
Model Number:	JTM-100504AD
MOQ:	1
Price:	￥800000
Packaging Details:	Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M2M2.8M
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan, Guangdong

Brand Name:

Jietai

Certification:

CE, FCC, ROHS, etc.

Model Number:

JTM-100504AD

Cleaning Frequency:

40KHZ/80KHZ

Type:

Ultrasonic Alkaline Washing+Ultrasonic Acid Washing+Pure Water Rinsing

Name:

Semiconductor Cleaning Machine

Cleaning Temperature:

60℃

Overall Dimensions:

12M*2M*2.8M

Model:

JTM-100504AD

Number Of Tanks:

Power:

120KW

Minimum Order Quantity:

Price:

￥800000

Packaging Details:

Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Delivery Time:

30-60work days

Payment Terms:

T/T

Supply Ability:

One unit. It will take 30 to 60 days.

Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaning System

Stage-by-Stage Cleaning Mechanism:

Ultrasonic Alkaline Cleaning: Operates at 40KHz-80KHz to generate controlled cavitation in alkaline media, efficiently stripping organic contaminants (e.g., photoresist, hydrocarbons) and particulate matter (≥1μm) from wafer surfaces and patterned structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafers, including edge bevels and backside surfaces.

Ultrasonic Acid Cleaning: Utilizes the same frequency range in acidic solutions to target inorganic impurities—specifically metal ion contaminants (Fe, Cu, Zn) and native oxide layers (SiO₂). This stage employs cavitation-induced micro-jets to dislodge sub-100nm particles embedded in trenches or vias, validated by laser particle counters (≤5 particles/wafer for ≥0.1μm).

Pure Water Rinse Cycle: Final rinse with UPW (ultra-pure water, TOC ≤3ppb) eliminates residual chemistries, achieving surface resistivity ≥18.2MΩ·cm to meet SEMI F020 standards for pre-deposition processing.

Technical Specifications:

Ultrasonic Frequency Band: 40KHz-80KHz (multi-frequency selectable via PLC, optimizing cavitation intensity for contamination type)

Process Temperature: 60℃ (PID-controlled, ±0.5℃ tolerance) to accelerate chemical reactivity without inducing wafer stress

Material Compatibility: Wetted components in PFA and high-purity alumina to resist HF/H₂SO₄ corrosion, preventing particle shedding

Core Performance Metrics:

Particle Removal Efficiency (PRE) ≥99.9% for ≥0.1μm contaminants

Chemical residue elimination ≤0.1ng/cm² (ICP-MS verified)

Compatible with automated cassette handling (FOUP/SMIF) for 24/7 fab integration