On June 4, 2025, as a leading global provider of environmentally friendly ultrasonic cleaning equipment solutions, Jietai Ultrasonic officially released a new generation of intelligent silicon wafer cleaning equipment. This device focuses on the precision cleaning needs of high-end manufacturing fields such as semiconductors and photovoltaics, integrating six core technologies including intelligent cleaning, intelligent control, and multifunctional cleaning. With a fully automated and precise cleaning solution, it provides innovative solutions for improving yield and optimizing efficiency in the silicon wafer production process. ​
Six core technologies reconstruct precision cleaning standards
1. Intelligent cleaning: fully automated and compatible with multiple sizes of silicon wafers
The equipment adopts a fully automatic loading and unloading cleaning mode, which achieves unmanned operation of the entire process from loading, cleaning to unloading of silicon wafers through intelligent robotic arms and visual recognition systems, significantly reducing manual intervention errors. At the same time, the innovatively designed adjustable carrier system supports compatible cleaning of 4-12 inch full-size silicon wafers, allowing for quick switching between different specifications of products without the need for hardware replacement, meeting the diverse production needs of the semiconductor and photovoltaic industries, and leading the industry in equipment scalability. ​
2. Intelligent control: One click switching of multiple cleaning modes
Equipped with PLC intelligent control system and 12 inch high-definition touch screen, preset 30+commonly used cleaning programs in the industry, and support user-defined parameter configuration. Through an intuitive human-computer interaction interface, operators can achieve * * "one click switching of cleaning mode" * *, automatically matching parameters such as ultrasonic power, cleaning time, liquid ratio, etc., greatly reducing the changeover time. Even complex process switching can be easily handled, significantly improving the flexibility of the production line. ​
3. Multi functional cleaning: Composite process achieves deep cleaning
Breaking through the limitations of traditional single ultrasonic cleaning, the equipment integrates five cleaning technologies: ultrasonic cavitation, high-pressure spraying, dynamic stirring, bubble stripping, and pulse jet. Multiple cleaning processes can be used in combination to address different impurities such as particle pollutants, metal ions, and organic residues on the surface of silicon wafers: ultrasonic high-frequency vibration can dissolve stubborn stains, high-pressure spray can wash away residual gaps, bubble technology can improve liquid exchange efficiency, and multi-dimensional protection of micron level cleanliness is particularly suitable for semiconductor wafer cleaning with high purity requirements. ​
4. Rotating system: dynamically adjust to improve uniform cleanliness
Built in high-precision rotary drive device, supporting 0-300rpm speed stepless adjustment. The silicon wafer maintains a constant or variable speed rotation during the cleaning process, and is equipped with a multi angle spray arm design to ensure that the cleaning solution evenly covers the surface of the silicon wafer, eliminating the cleaning blind spots at the edges and center. Through actual testing, this technology can improve the consistency of silicon wafer surface cleanliness by 20%, effectively solving the local pollution problem of traditional static cleaning. ​

5. Automatic liquid change: intelligent liquid management throughout the entire process
Integrated automatic water inlet and outlet system, intelligent replenishment device, and three-stage filtration circulation system, real-time monitoring of cleaning solution conductivity, pH value, and turbidity data. When the liquid index exceeds the set threshold, the system automatically triggers the liquid replacement program, synchronously completing the discharge of old liquid, replacement of filter element, new liquid ratio and temperature adjustment, to avoid the fluctuation of cleaning effect caused by delayed manual liquid replacement. Combined with a 10 μ m precision circulating filtration device, it can effectively intercept small particle impurities and extend the service life of the medicine by more than 30%. ​
6. Detection system: online monitoring to ensure process stability
The cleaning tank is equipped with an online pH monitor and a pure water TOC online detector, which provide real-time feedback on the chemical status of the cleaning solution and pure water purity data. Abnormal data is automatically alerted and triggers process adjustments. By integrating with the MES system, the equipment can achieve full traceability of cleaning process data, generate real-time curves containing parameters such as temperature, pressure, and liquid composition, and provide customers with complete process validation reports, meeting international quality system certification requirements such as IATF 16949. ​
Accurately adapting to high-end manufacturing scenarios to assist in industrial upgrading
This equipment is mainly aimed at high-end fields such as semiconductor wafer manufacturing, photovoltaic silicon wafer processing, MEMS sensor production, etc. It can significantly improve the yield of key processes such as front-end cleaning in chip manufacturing and cleaning after photovoltaic silicon wafer velvet/etching. According to actual measurement data from a leading photovoltaic enterprise, the use of Jietai intelligent cleaning equipment has reduced the residual particle rate on the surface of silicon wafers from 5.2% to 1.3%, shortened the cleaning time of a single batch by 15%, and reduced comprehensive energy consumption by 20%, effectively helping customers achieve the dual goals of cost reduction, efficiency improvement, and green production. ​
As the semiconductor and photovoltaic industries evolve towards higher precision and larger sizes, the importance of precision cleaning has become increasingly prominent, "said Jietai Ultrasonic Technology Director." We always adhere to the concept of 'technological innovation drives industrial upgrading', and through the collaborative breakthrough of six core technologies, we not only solve the efficiency and accuracy bottlenecks of traditional cleaning equipment, but also provide customers with flexible production solutions that can be quickly iterated through intelligent and modular design
About Jietai Ultrasound
As a national high-tech enterprise, Jietai Ultrasonic has been deeply involved in the field of ultrasonic cleaning for more than 20 years, with over 50 intellectual property rights and 30000+industry cleaning solutions. Its products are exported to more than 30 countries worldwide and serve internationally renowned enterprises such as Samsung Semiconductor, LONGi Green Energy, and SMIC. In the future, the company will continue to increase its research and development investment in cutting-edge technologies such as AI visual inspection and digital twin process simulation, promote the upgrading of precision cleaning equipment to "smarter, greener, and more efficient", and help promote the high-quality development of the global high-end manufacturing industry.