Brief: Discover the **JTM-10720AD**, a fully automatic ultrasonic cleaning machine designed for semiconductor silicon wafers. This 10-tank system ensures precision cleaning with 40kHz high-frequency cavitation, robotic handling, and high-purity materials for flawless semiconductor manufacturing.
Related Product Features:
40kHz high-frequency cavitation removes particles as small as 0.2μm without physical contact.
10-tank integrated workflow for multi-stage cleaning, rinsing, and drying.
Precision robotic arm with Teflon-coated grippers ensures gentle wafer transfer.
PLC + HMI interface for programming 100+ custom recipes and real-time monitoring.
Constructed from electropolished 316L stainless steel and PTFE for high purity.
Closed-loop filtration reduces chemical consumption by 60% and ensures fluid purity.
DryN₂™ rapid drying system achieves spot-free, static-free surfaces.
SEMI-compliant materials and design for consistent, repeatable results.
คำถามที่พบบ่อย:
What types of contaminants can this machine remove?
The machine effectively removes sub-micron particles, organic residues, metal ions, and native oxides from semiconductor silicon wafers.
Is the system compatible with both 300mm and 200mm wafers?
Yes, the JTM-10720AD is engineered to handle both 300mm and 200mm wafers with precision and care.
How does the DryN₂™ drying system work?
The DryN₂™ system uses heated nitrogen (≤5% RH) to rapidly dry wafers, ensuring spot-free and static-free surfaces.