آلة تنظيف بالموجات فوق الصوتية تلقائية بالكامل رقائق السيليكون معدات تنظيف بالموجات فوق الصوتية 100 كيلوواط

فيديوهات أخرى
July 17, 2025
Brief: Discover the **JTM-10720AD**, a fully automatic ultrasonic cleaning machine designed for semiconductor silicon wafers. This 10-tank system ensures precision cleaning with 40kHz high-frequency cavitation, robotic handling, and high-purity materials for flawless semiconductor manufacturing.
Related Product Features:
  • 40kHz high-frequency cavitation removes particles as small as 0.2μm without physical contact.
  • 10-tank integrated workflow for multi-stage cleaning, rinsing, and drying.
  • Precision robotic arm with Teflon-coated grippers ensures gentle wafer transfer.
  • PLC + HMI interface for programming 100+ custom recipes and real-time monitoring.
  • Constructed from electropolished 316L stainless steel and PTFE for high purity.
  • Closed-loop filtration reduces chemical consumption by 60% and ensures fluid purity.
  • DryN₂™ rapid drying system achieves spot-free, static-free surfaces.
  • SEMI-compliant materials and design for consistent, repeatable results.
أسئلة وأجوبة:
  • What types of contaminants can this machine remove?
    The machine effectively removes sub-micron particles, organic residues, metal ions, and native oxides from semiconductor silicon wafers.
  • Is the system compatible with both 300mm and 200mm wafers?
    Yes, the JTM-10720AD is engineered to handle both 300mm and 200mm wafers with precision and care.
  • How does the DryN₂™ drying system work?
    The DryN₂™ system uses heated nitrogen (≤5% RH) to rapidly dry wafers, ensuring spot-free and static-free surfaces.
فيديوهات ذات صلة