6L Ultrasonic Cleaner With Intelligent Control, Frequency Sweeping And Degassing Functions – Laboratory And Medical Industry Equipment

1. Intelligent Degassing System
   Equipped with a built-in vacuum degassing pump and liquid level sensor, it can reduce the gas content in the cleaning solution to below 0.5% within 3 minutes (the gas content in conventional solutions is about 5%), achieving three core advantages:

• Enhanced Cavitation Effect: After degassing, the energy released by bubble collapse increases by 25%, and the cleaning efficiency at the same power level is improved by 30%. For example, the time required to remove sludge from 0.1mm - deep grooves in bearing raceways is shortened from 15 minutes to 10 minutes.
• Protection of Sensitive Materials: It prevents the formation of cavitation pits on the surfaces of easily oxidizable materials such as aluminum workpieces and silver ornaments. The removal rate of the oxidation layer on silver ornaments after degassing cleaning exceeds 99.5%, and no new scratches are generated.
• Stable Cleaning Performance: It eliminates the inconsistent cleaning caused by fluctuations in the gas content of the solution. The fluctuation of the yield rate between batches is controlled from ±8% to ±2%, meeting the strict consistency requirements of ISO 13485 for medical device cleaning.

2. Dynamic Frequency Sweeping Technology
   Through a broadband transducer array and an AI - based frequency tracking algorithm, it supports full - band scanning from 20 to 80kHz (with an accuracy of ±0.05kHz) and automatically matches the optimal cleaning frequency:

• Layered Removal of Mixed Contaminants For PCB pad cleaning: 25kHz breaks solder balls first, then 75kHz strips flux ionic residues, cutting defect rate from 1.1% to 0.08%.
• Real-Time Adaptive Calibration Against Working Condition Changes: When liquid temperature rises from 25°C to 60°C or liquid level fluctuates ±10%, frequency calibration finishes within 0.3s. Traditional machines suffer 15% average cleaning power loss from frequency drift, while our unit limits loss within 3%.
• Deeper Energy Penetration for Complex Blind Hole Parts: For MIM precision components with blind holes over 5mm deep, 35–55kHz sweep mode increases ultrasonic penetration depth by 40%. Blind hole bottom cleanliness meets VDA 19.1 standard, with less than 5 particles ≥5μm per 100cm² residual.